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TP080 thermal pad/ thermal gap filler pad/thermal conductive pad
Product Detailed
Related Categories:Insulation Materials & Elements
The largest developer and manufacturer of soft thermal conductive gap fllier pad,thermal conductive insulator pad
silicone thermal pad/thermal gap filler pad/thermal conductive pad Typical Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Specification Sheet:
Typical Properties of TP080 | |||
| Properties | Units | TP080 | Test Method |
| Construction & Composition | ---- | Silicone & Ceramic filled | ---- |
| Color | ---- | Gray | Visual |
| Thickness Range | mm | 0.5~12.0 | ---- |
| Hardness | Shore C | 18 | ASTM D2240 |
| Density | g/cc | 2 | ASTM D792 |
| Tensile Strength | KN/m | 1.3 | ASTM D412 |
| Elongation | % | 1.35 | ASTM D412 |
| Continuous Use Temp | -40 to 150 | EN344 | |
| Breakdown Voltage | Kv/mm | ≥4.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 1.7*1016 | ASTM D257 |
| Dielectric Constant | 1MHz | 4.51 | ASTM D150 |
| Weight Daminify | ---- | ≤1 | @150 240H |
| Flame Rating | ---- | V0 | UL 94 |
| Thermal Conductivity | W/m.k | 0.8 | ASTM E1461 |
| UL, RoHS, REACH | ---- | Compliance | ---- |
TP080 thermal pad/ thermal gap filler pad/thermal conductive pad
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